| 摘要 |
<p>PURPOSE:To provide a resin sealing method by which the width and the height of a resin mold can be made smaller without damaging a resin coating property and without causing a gap inside the resin mold. CONSTITUTION:Many chips 2 are connected to and mounted on conductor patterns on the board 1 respectively by wires 3, 4. On the board, connecting parts of the wires 3, 4 to conductors and regions near them are coated with a resin containing a component whose filler diameter is large; regions other than them are coated with a resin containing a component whose filler diameter is small; and the chips 2 and the wires 3, 4 are covered wholly with a resin mold 9. The viscosity of the outside region at the resin mold is high, the viscosity of the inside region is low, and the width and the height of the resin mold can be made small.</p> |
