| 摘要 |
PURPOSE:To improve heat resistance by mixing a specific epoxy resin dispersion with an aliph. alcohol and removing liq. components from the mixture. CONSTITUTION:100 pts.wt. the sum of an epoxy resin, an amine curative in an amt. almost equimolar to the epoxy groups of the epoxy resin, and, if necessary, a curing accelerator in an amt. of 0.1-20wt.% of the curative is reacted to cure in 50-1000 pts.wt. oligomer which has a b.p. of 200 deg.C or higher and a mol.wt. of 1000 or higher, dissolves the resin and the curative at the temp. of the reaction, and does not interfere with the reaction, thereby giving a cured epoxy resin dispersion. After 100 pts.wt. the dispersion is mixed with 10-10,000 pts.wt. 1-6C aliph. alcohol, liq. components are removed from the mixture and the residue is dried to give a cured epoxy resin powder having a particle size of 0.5-100mum, a glass transition temperature of 100 deg.C or higher, a mean sphericity of 0.9 or higher, and hydroxyl groups and tert. amino groups. |
