发明名称 WIRE BONDING APPARATUS AND WIRE BONDING SYSTEM
摘要 PURPOSE:To unnecessitate a vacant magazine, realize reduction in size of an apparatus and simplify a structure and moreover facilitate maintenance and management by using an accommodating part as a loader and an unloader. CONSTITUTION:In a wire bonding apparatus 10, a magazine 3 accommodating lead frames is transferred to an accommodating part 11 from a transfer part 15 by a first transferring means 23. Here, lead frames are sent to a bonding part 12 by a second transfer means 13 from the magazine 3 for execution of the wire bonding. After the wire bonding, a lead frame is accommodated again in the initial magazine 3 of the accommodating part 11 by a second transfer means 13. The magazine 3 having completed the wire bonding is returned to a transfer part 15 from the accommodating part 11 by a third transfer means 23.
申请公布号 JPH04245651(A) 申请公布日期 1992.09.02
申请号 JP19910031757 申请日期 1991.01.31
申请人 SONY CORP 发明人 GOTO KIKUO;NISHIZAKI MITSUHIRO
分类号 H01L21/50;H01L21/60 主分类号 H01L21/50
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