| 摘要 |
<p>PURPOSE:To enhance yield of an assembling process of a semiconductor device, to prevent a mounting malfunction when the device is mounted on a mounting board, and to provide a lead frame which can perform the purposes. CONSTITUTION:(A):a manufacturing method for a semiconductor for forming solder layers 3C on the surfaces of a plurality of outer leads 3B comprises a step of sequentially drawing up the leads 3B from a solder tank from an initial stage of a lead array 3 toward a final stage, and (B): an step of guiding excess solder adhered to the lead 3B of the final stage of the array 3 to the outer region of the lead 3B of the final stage of the array 3. A groove 4 is provided on the outer region of the lead 3B of the initial or final stage of the array in which a plurality of the leads 3B are arranged in a lead frame 1 having the plurality of the leads 3B.</p> |
