The present room temperature curing composition comprises an organopolysilethylenesiloxane represented by the following general formula: <CHEM> wherein R<1> to R<4> each represent an alkyl having up to 8 carbon atom or a phenyl group and n is an integer of 10 or above, and an organosilane or an organosiloxane having two or more hydrolyzable groups such as alkoxy groups in the molecule. The composition can form a cured product high in rubber strength and excellent in chemical resistance.
