| 摘要 |
<p>PURPOSE:To achieve that a semiconductor substrate which is not circular like an optical semiconductor substrate but which is four-cornered is coated with a resist so as to be a uniform film thickness. CONSTITUTION:Shape-correcting plates 1, 2 are pressed to the circumference of a four-cornered semiconductor substrate 3; the shape of a resist coating face at the substrate 3 is corrected to be circular. Thereby, the resist film thickness at four corners of the substrate 3 is corrected, and the film thickness on the whole face of the substrate is made uniform.</p> |
