| 摘要 |
PURPOSE:To provide the title IC mounting method of stable electrical connection solving the problem of defective connection due to the minor gap between the IC chip and a circuit substrate in relation to the connecting method of the IC chip applicable to electronic equipment to the circuit substrate such as liquid crystal panel, etc. CONSTITUTION:A spacer 6 thicker than the bump contacts 2 of an IC chip 1 is fixed between the IC chip 1 and a circuit substrate 5 using a bonding agent and then the bump contacts 2 of the IC chip 1 coated with a conductive bonding agent 4 and the electrode terminals 6 of the circuit substrate 5 are aligned and coupled with one another while said bonding agent 4 is thermoset so as to electrically connect the IC chip 1 to the circuit substrate 5. |
