| 摘要 |
<p>1,055,780. Soldering. MULLARD Ltd. Oct. 19, 1965 [Nov. 19, 1964], No. 47151/64. Heading B3R. In soldering a plurality of electrically conductive pins held in a base-plate to an electrically conductive pattern formed on a substrate, the pins are mounted in the base-plate so that one end of each of the pins lies in a plane, the said ends of the pins are coated with solder, the pattern is arranged to bear on the coated ends of the pins and the solder is melted. The pins 2, Fig. 2 (not shown) of a plug-in unit are sealed into apertures in the base-plate by glass to metal seals using a jig for alignment and the ends 5 of the pins are dipped in a solder bath so that a blob of solder adheres to each of the pins. The substrate 4 carrying the pattern is inverted and the pattern and ends of the pins are contacted with the aid of a jig and the assembly is passed through an induction coil to melt the solder on the pins. The contact of pattern and pins may be effected by gravity, springs or pressure pads. A cover 6 is then soldered on the base-plate over the substrate. The pins may lie at an angle to the substrate.</p> |
