| 摘要 |
PURPOSE:To increase the lifetime of the electronic component by forming the bonding boundary between a metal and a glass having uneven state, thereby increasing the bonding property and protecting the element contained in a container formed of the metal and the glass from moisture or the like. CONSTITUTION:A metal cap 9 is fixedly bonded to a metal stem 6 arranged with a light emitting diode 1. The inner wall surface 13 of the opening of the cap 9 is formed unevenly. When a glass plate 10 is bonded to the cap 9, it is connected, and heated to fuse the peripheral edge of the glass plate 10 and to bond the peripheral surface of the plate 10 to the uneven surface of the inner wall of the cap 9. A lead wire 5 of the diode 1 and the seal of the stem 6 are similarly formed by forming uneven state on the inner wall 15 of the lead wire mounting hole of the stem 6 and bonding the outer peripheral surface 14 of the connector 4 around the lead wire 5 to the uneven surface of the wall. |
