| 摘要 |
PURPOSE:To provide a method of accurately measuring a polishing amount of a workpiece mounted on a workpiece holding jig, in the case of a lapping machine of type such that the workpiece holding jig, provided in a correcting ring, is mounted on a lapping surface plate to turn together the correcting ring and the workpiece holding jig according to rotating the lapping surface plate. CONSTITUTION:In the case of a lapping machine of type such that a workpiece holding jig 3, provided in a correcting ring 1, is placed on a lapping surface plate to turn together the correcting ring 1 and the workpiece holding jig 3 according to rotating the lapping surface plate 5, a polishing amount of a workpiece is detected by measuring relative displacement between the above- mentioned correcting ring 1 and workpiece holding jig 3. |
