Apparatus for handling devices under varying temperatures

摘要

Apparatus (10) for handling devices for testing under varying temperature conditions is disclosed including a mechanical arm (32) pivotally mounted by a bearing (34) to a control portion (16) which is variably vertically positionable relative to a platform portion (14). An insert arm (38) is rotatably mounted within the mechanical arm (32) to reciprocally and rotatably mount a thermal socket (90) for mating with a contactor (126). The socket (90) is mounted to a vacuum cup (48) to allow position alignment as alignment pins (132) are initially slideably received in alignment notches (124) and when no vacuum is applied and is fixed in the aligned position after the application of vacuum. Thermal tubes (74) of probes (50) are reciprocal with the thermal socket (90) to provide thermally conditioned gas/air to the thermal socket (90). The thermal socket (90) provides a swirling action to the thermally conditioned gas/air to exit 360 DEG around a vacuum cup (112) holding the device in the thermal socket (90) for circulating the thermally conditioned gas/air across the top and past the leads of the device. The apparatus (10) monitors and controls the device core temperature by measuring the temperature of the bottom of the device and of a thermally spaced location of a pedestal (144) abutting the bottom of the device and determining the rate of heat flow through a temperature sensing loop.