SPRAY DEPOSITION METHOD AND APPARATUS THEREOF

摘要

PCT No. PCT/GB89/00626 Sec. 371 Date Jan. 22, 1991 Sec. 102(e) Date Jan. 22, 1991 PCT Filed Jun. 6, 1989 PCT Pub. No. WO89/12115 PCT Pub. Date Dec. 14, 1989.There is provided a method of spray deposition in which a stream of liquid metal or metal alloy is atomized inside a spray chamber into a spray of atomized droplets. A metal or metal alloy collector is rotated about an axis transverse to the mean axis of the spray and in the path of the spray so that a deposit is formed about the collector with a bond between the deposit and the collector sufficient to isolate the interface from oxygen penetration. The collector is then retained as an integral part of the final product and further processed to substantially eliminate porosity in the region of the bonded interface. The collector and the deposit may be the same or different materials, and the bond between the deposit and the collector is preferably enhanced by plasma heating in the region disposition. The invention also provides a plant for carrying out the preferred method arc plasma heating.