LAMINATED BOARD FOR PRINTED CIRCUIT

摘要

PURPOSE:To obtain a laminated board for a printed circuit having excellent heat resistance and workability. CONSTITUTION:In a laminated board for a printed circuit of a composite structure in which a glass cloth is provided on a surface layer and nonwoven fabric is provided on an intermediate layer, a base material of the surface layer and/or a core layer is heat treated and impregnated with radical curable unsaturated resin mixed with gypsite type aluminum hydroxide, and then, thermally cured to manufacture the laminated board.