发明名称 BONDING METHOD OF COATED WIRE
摘要 PURPOSE:To enable improving the reliability of a second bonding in the bonding method of a coated wire. CONSTITUTION:The title method has a reinforced bonding process 33 continuing from a second bonding process 32. In the reinforced bonding process 33, there is formed a reinforced bonding part 35 of a size which can cover a second bonding 19.
申请公布号 JPH04243142(A) 申请公布日期 1992.08.31
申请号 JP19910004050 申请日期 1991.01.17
申请人 FUJITSU LTD 发明人 KUROKAWA TETSUO
分类号 H01L21/60 主分类号 H01L21/60
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