MANUFACTURE OF FLAT PACKAGE TYPE LSI

摘要

PURPOSE:To improve the yield and reliability of a flat package type LSI by covering a lead frame with a protective cover before solder cream is put on a capacitor pad. CONSTITUTION:When a chip capacitor 4 is mounted on a capacitor connecting pad 3, a protective cover 8 is put on a lead frame before the chip capacitor 4 is mounted. Then the chip capacitor 4 is put on solder cream after the solder cream is put on a capacitor connecting pad 3 and a capacitor electrode 5 is connected to the pad 3 by heating the entire body of a flat package so as to melt the solder cream.