| 摘要 |
PURPOSE:To realize a high-density surface mounting of a capacitor to a printed board without changing the ordinary structure of the capacitor. CONSTITUTION:A capacitor 1 is housed in an outer packaging frame 2 which has a housing space 4 fit for the outer shape of the capacitor 1 that has an adhesion layer 7 made chiefly of thermosetting resin in a part of the bottom face, and leads 3 led out from the end face of the capacitor 1 are bent along the opening end face and then along the bottom face of the outer packaging frame 2. As for the method for mounting such a chip-type capacitor 20, the capacitor 20 is mounted on a printed board 10 first and then is heat-treated to be secured to the printed board 10. |
