| 摘要 |
PURPOSE:To provide an appropriate lighting apparatus for using in inspection of a bonding wire such as hybrid ICs with various directions and shapes of the bonding wire. CONSTITUTION:A plurality of LED lamps 14aa to 14ah, 14ba to 14bh and 14ca to 14ch constitute three ring LED arrays 15a to 15c, and the LED arrays 15a to 15c are placed concentrically while they have different lighting angles respectively against an object to be illuminated. Then light emission of the respective LED lamps 14ah to 14ch is selectively controlled according to the object to be illuminated. |
