| 摘要 |
PURPOSE:To make it possible to achieve a compact configuration and mass production, to make it possible to achieve the large displacement of a vibrating body by an input angular velocity and to obtain the excellent output by forming a sensor by using a semiconductor process technology. CONSTITUTION:A vibrating body 32 which is vibrated in parallel with a substrate 31, flexible supporting bodies 33a, 33b, (33c and 33d) for supporting the vibrating body 32, pairs of vibration driving electrodes 35a and 35b, and 34a and 34b which are attached to the vibrating body 32 and the substrate 31, respectively, and detecting electrodes 36a and 26b for detecting the displacement of the vibrating body 32 are formed of semiconductors made of the same material on the substrate 31. The thickness of the vibration driving electrodes 34a and 34b is made smaller than the thickness of the counter electrodes 35a and 35b. Thus, the electrodes 34a and 34b can be deflected in the vertical direction. |
