| 摘要 |
PURPOSE:To prevent the fracture of a connecting section caused by a stress produced between materials having different coefficients of thermal expansion. CONSTITUTION:This semiconductor device is composed of a chip carrier 10 which is provided with a substrate 4 for chip carrier with a wiring pattern 2 formed near the central part in the lower section of a aluminum nitride substrate 1 except a recessed part and the central part, semiconductor chip 5 stuck to the recessed section of the substrate 4, and Au wires for connecting the chip 5 to the pattern 2 and a package substrate 16 on which a chip carrier in which the chip 5, wire 7, and inside of the pattern 2 are sealed with silicone gel 8 and through holes into and to which nail head pins 13 are inserted and fixed and around which a wiring pattern 12 formed. Then the inner end section of the wiring pattern 12 on the upper surface of the package substrate 16 is electrically connected to the outer end section of the wiring pattern 2 on the lower surface of the chip carrier 10 by means of a flexible wiring board 9. |
