| 摘要 |
PURPOSE:To provide a semiconductor package for arranging semiconductor chips which is specially contrived to arrange semiconductor chips in a space saving way. CONSTITUTION:This semiconductor package is constituted of chip wiring boards 5 equipped with lead patterns 3 provided on base sections 6 having different sizes in corresponding to the terminal section 2 of each semiconductor chip 1 and a package main body 20 equipped with package leads 8 provided in corresponding to the lead pattern 3 of each chip wiring board 5 and the chip wiring boards 5 equipped with the semiconductor chips 1 are successively mounted on the package main body 20. |
