LITHOGRAPHIC PROCESS OF ELECTRIC BEAM

摘要

The lithography process using a multi-layer resist film comprises spin-coating a first photoresist film (PR1) on a substrate to form a planarized layer for planarizing a exposure surface, spincoating an insulating film (I) on the photoresist (PR1) to form a protection layer, depositing a metallic thin film (M) on the film (I) by using a sputtering method to cover the electron loss upon irradiating electron beams and spin-coating a second photoresist film (PR2) on which a photoresist pattern is formed for a etching process.