| 摘要 |
PURPOSE:To provide a low-temperature burnt glass ceramic material suitable as an insulating substrate for multilayer circuit board, having high mechanical strength of insulating substrate, low coefficient of thermal expansion and dielectric constant, using copper as a conductive material, simultaneously burnable at low temperature close to 1,000 deg.C. CONSTITUTION:Borosilicate glass is blended with a ceramic insulating material and burnt at 900-1,050 deg.C to give a sintered material of glass ceramics consisting of a crystal layer comprising 18-24wt.% alumina, 8-17wt.% quartz and 13-25wt.% cordierite and the rest of borosilicate glass having 770-850 deg.C softening point. |
