| 摘要 |
An electric circuit wherein an insulating material (8) having a coefficient of linear expansion approximately equal to that of glass is bonded to a part where an electrode pattern (3) formed on a glass substrate (2) is connected to a conductive pattern (6) formed on a substrate made of an insulating material such as polyimide or the like, thereby restricting the thermal stress to be small at the connecting part between the conductive pattern (6) and electrode pattern (3). <IMAGE> |
