| 摘要 |
<p>PURPOSE:To obtain the structure of a semiconductor acceleration sensor so that a weight can be stuck at the fixed position of a sensor chip and the adhesive strength can be improved by an adhesive. CONSTITUTION:A stopper section 9 is provided in the chip adhesive groove 8 of a weight 7, the stopper section 9 is stuck at the tip face 1a of a sensor chip 1, and the positioning of the weight 7 can be performed easily and correctly. An adhesive area expanding hole 10 is provided in the chip adhesive groove 8, when the weight 7 is stuck at the free end of the sensor chip 1 with an adhesive 6, the adhesive 6 infiltrates into the adhesive area expanding hole 10, the adhesive area of the adhesive 6 to the weight 7 is expanded as compared with a flat plane, and the adhesive strength between the sensor chip 1 and the weight 7 is increased that much.</p> |
