Method for making diaphragm-based sensors and apparatus constructed therewith.
摘要
<p>A diaphragm transducer 201 is manufactured by forming cavities in a diaphragm layer which are backfilled with a material readily removed by etching. The diaphragm layer is bonded to a silicon wafer. Access passages are provided to enable removal of the backfill material. The transducer 201 is incorporated in a three-wafer capacitive sensor 4 bonded to a pressure tube 5 with pressure ports 204 and 205 leading to access pressure ports 206. <IMAGE></p>
申请公布号
EP0500234(A2)
申请公布日期
1992.08.26
申请号
EP19920300996
申请日期
1992.02.06
申请人
HONEYWELL INC.
发明人
HOCKER, BENJAMIN G.;IKINWANDE, AKINTUNDE I.;BURNS, DAVID W.;HORNING, ROBERT D.;MIRZA, AMIR R.;SAATHOFF, DIEDRICH J.;STRATTON, THOMAS G.;CARNEY, JAMES K.