发明名称 FLUX FOR AQUEOUS SOLDERING
摘要 PURPOSE: To provide a soldering flux which can be washed out by water and/or detergent and besides does not adversely impact the surface insulation resistance(SIR) of a circuit board. CONSTITUTION: A water-soluble soldering flux which does not adversely impact the surface insulation resistance of a circuit board is comprised of a water-soluble vehicle, an activator and a hydrophobic surfactant preferentially adsorbed at the circuit board surface. At soldering temperatures, the activator reacts to clean metallized areas on a circuit board and promote solder wetting. The hydrophobic surfactant, which is preferentially adsorbed at the circuit board surface, acts to block the diffusion of hydrophilic vehicle molecules into the circuit board to prevent the degradation of circuit board's surface insulation resistance.
申请公布号 JPH04237593(A) 申请公布日期 1992.08.26
申请号 JP19910180496 申请日期 1991.06.26
申请人 AMERICAN TELEPH & TELEGR CO <ATT> 发明人 KOOTONII BUI DOTSUDO;GUREGORII SHII MUUNII
分类号 B23K35/363;B23K35/36;B23K101/42;C09D5/00;C09D5/25;H05K3/34 主分类号 B23K35/363
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