| 发明名称 |
Protecting tape automated bonding devices. |
| 摘要 |
<p>The copper fan out circuitry (6) on the underside of a tape automated bonding (TAB) device (3) is coated with an electrically non-conductive organic polymer (60) to provide mechanical rigidity and environmental protection to the device. <IMAGE></p> |
| 申请公布号 |
EP0500235(A1) |
申请公布日期 |
1992.08.26 |
| 申请号 |
EP19920301005 |
申请日期 |
1992.02.06 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
PULIGANDLA, VISWANADHAM;VASAN, SRINI VARADARAJAN |
| 分类号 |
H01L21/60;H01L21/48;H01L21/56;H01L23/29;H01L23/495;H01L23/50;H05K3/28 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
