发明名称 PRODUCTION OF THERMOSETTING RESIN AND THERMOSETTING COMPOSITION USED THEREFOR
摘要 PURPOSE:To produce a thermosetting resin having excellent thermal characteristics using a solventless thermosetting resin composition having good handling properties and being liquid at ambient temperature. CONSTITUTION:(A) A polymaleimide compound such as bismaleimide is reacted with (B) a polyamino compound such as methylene dianiline and (C) maleimide based compound (e.g. allylmaleimide) having ethylenic unsaturated bond or nadic imide based compound (e.g. alylnadic imide) while heating in the presence of a radical catalyst, using the above-mentioned compound (C) at a weight ratio of 1/ 10 to 10 times based on total weight of the above-mentioned compound (A) and the compound (B) to provide the objective cured resin.
申请公布号 JPH04236228(A) 申请公布日期 1992.08.25
申请号 JP19910014938 申请日期 1991.01.16
申请人 TEIJIN LTD 发明人 HIRATA SHIGEKI;YAMADA KENKO;UMETANI HIROYUKI
分类号 B29C39/02;B29K79/00;C08G73/12;C08K5/3415;C08K5/3417;C08L79/00;C08L79/02;C08L79/08 主分类号 B29C39/02
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