| 摘要 |
A process for shaping a metal substrate lacquered by a cathodic electro dip process and then baked, involving heating the lacquered and baked substrate to a temperature between a lower limit of from about 30 DEG C., suitably 20 DEG C., below the glass transition temperature of the lacquer and an upper limit of just below the decomposition temperature thereof, and then shaping the coated and baked substrate in the thus heated state. Shaping of the lacquered, baked substrate is suitably carried out by rolling, pressing, crimping, or dimpling.
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