| 摘要 |
PURPOSE:To eliminate a soldering step for applying a thermal stress to a semiconductor package and to obviate a soldering malfunction, a semiconductor element malfunction by using the package having a connector structure in a mounting connection of a semiconductor to a printed circuit board. CONSTITUTION:Gold-plated leads 2 are connected to a semiconductor chip 3 by gold bonding wires 4, and the entirety is packaged by a molding material 5 to form a semiconductor package P. A male connector structure 1 is provided at the molded end of the leads 2, and connected to a female connector on a printed circuit board 10. In this case, the package can be mounted on the board 10 without heating by using a through hole female connector 11 or a surface mounting female connector 12. Accordingly, application of a thermal stress to the chip and the package is eliminated, and reliability after they are mounted to be connected to the board is not lost. A soldering malfunction can also be prevented. |
