发明名称 High frequency linear amplifier assembly
摘要 A wide bandwidth linear amplifier (10) that has an operating band in excess of 1 GHz mounts the high power dissipating components (11) of the amplifier (10), and the components 917, 18) that control the high frequency gain and stability of the amplifier (10) onto a daughter board (32) that has a high thermal conductivity. The daughter board (32) and the remaining circuit components (21, 22, 23, 24, 26a, 26b) are then mounted on a mother board (31) that has a lower thermal conductivity. The assembly (30) reduces the circuit's parasitic inductance (46, 47, 48, 49) and parasitic capacitance (51, 52), and provides unconditional stability at high frequencies.
申请公布号 US5142239(A) 申请公布日期 1992.08.25
申请号 US19910702490 申请日期 1991.05.20
申请人 MOTOROLA, INC. 发明人 BRAYTON, DANIEL C.;LAU, NGAI-MING
分类号 H03F1/22;H03F1/42;H03F3/191;H03F3/60;H05K1/02;H05K1/03;H05K1/14;H05K1/16;H05K3/32;H05K3/34;H05K3/36 主分类号 H03F1/22
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