| 摘要 |
PURPOSE:To reduce the number of probes and facilitate analysis for defects by converging light receiving elements and luminous elements at the input and output terminals of an IC element and checking points in a circuit. CONSTITUTION:Light receiving elements 2 are converged in response to input and luminous elements 2 are converged in response to output, being connected to test pads 1 in one chip on a wafer. Light receiving elements and luminous elements 3 are converged in response to intermediate output and intermediate input as necessary. At testing, a probe is allowed to contact only with a source pad. Thus, the limitation of the accuracy of the probe is remarkably widened, semiconductor elements marks, etc. corresponding to the light receiving elements and luminous elements on the whole surface of one wafer are placed facing against a wafer to be inspected, and all elements can be measured through the luminous and light receiving elements without positioning chip individually. |
