发明名称 HEAT SEALABLE BLEND OF VERY LOW DENSITY POLYETHYLENE OF PLASTOMER WITH POLYPROPYLENE BASED POLYMERS AND HEAT SEALABLE FILM AND ARTICLES MADE THEREOF
摘要 <p>2103790 9214784 PCTABS00015 Heat sealable compositions suitable for film and film structures comprise: (a) from 30 to 70 weight percent of a low melting polymer comprising an ethylene based copolymer having a density of from 0.88 g/cm3 to 0.915 g/cm3, a melt index of from 1.5 dg/min to 7.5 dg/min, a molecular weight distribution no greater than 3.5, and a composition distribution breath index greater than 70 percent; and, (b), being different from (a), from 70 to 30 weight percent of a propylene based polymer having from 88 mole percent to 100 mole percent propylene and from 12 mole percent to 0 mole percent of an alpha-olefin other than propylene.</p>
申请公布号 CA2103790(A1) 申请公布日期 1992.08.23
申请号 CA19922103790 申请日期 1992.02.24
申请人 EXXON CHEMICAL PATENTS INC. 发明人 MEHTA, ASPY K.;CHEN, MICHAEL C.
分类号 B32B27/32;B32B27/08;C08J5/18;C08L23/00;C08L23/08;C08L23/10;C08L23/14;(IPC1-7):C08L23/08;B32B27/06 主分类号 B32B27/32
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