MULTILAYER CIRCUIT BOARD ASSEMBLY AND ITS MANUFACTURE

摘要

PURPOSE: To provide a multilayer circuit board assembly having selected layers of substantially higher densities than other layers of substantially small resistance and hence high current capacities. CONSTITUTION: A multilayer circuit board assembly is provided which includes a first and a second laminate assemblies 20, 40 each having conductive wirings 21, 25, 29 and at least one through-hole 35, 55. The first laminate assembly 20 has a higher wiring density than that of the second laminate assembly 40 which has lower electric resistance than that of the first laminate assembly 20.