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发明名称
FORMING METHOD OF SEMICONDUCTOR DEVICE MULTILAYER INTERCONNECTION INTERLAMINAR INSULATING FILM
摘要
申请公布号
JPH04234149(A)
申请公布日期
1992.08.21
申请号
JP19900418464
申请日期
1990.12.28
申请人
NEC CORP
发明人
HONMA TETSUYA
分类号
H01L21/768;H01L23/522
主分类号
H01L21/768
代理机构
代理人
主权项
地址
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