Method of assembling and interconnecting modular electronic cards, cards and set of electronic cards according to this method

摘要

The invention relates to the fabrication of electronic cards with hybrid integrated circuits and with interconnection studs, in which the male 5 and the female 3 studs are fastened directly by soldering 8 onto the outer faces of the integrated circuit substrates 2. By a judicious choice of the locations of the studs 3 and 5, it is possible to arrange that all the studs interact with studs of an adjacent card, thus leaving a maximum space free for accommodating electronic components 10.