| 摘要 |
PURPOSE:To enable a bump of high aspect ratio to be easily formed. CONSTITUTION:A board connecting bump is formed by enabling gold contained in gold paste 2 which is filled into a VIA hole 3 provided to a glass ceramic board green sheet 1 to protrude from the front and the rear side of a glass ceramic board at sintering taking advantage of the shrinkage difference between the green sheet 1 and the gold paste 2 filled into the VIA hole 3. The bump is composed of the glass ceramic board green sheet 1 and the gold paste 2 filled into the VIA hole 3 provided to the green sheet 1. |
