| 摘要 |
<p>PURPOSE: To improve productivity and yield by solder tape automated bonding of leads to an integrated circuit chip by using a fixed plate maintaining a constant temperature flat surface thermode and leads, in contact with the integrated circuit chip. CONSTITUTION: Leads 5 are aligned with bumps 3, which is made to descend on the leads with a sufficient pressure such that the leads 5 come close into contact with the bumps 3. The temperature of a flat surface thermode must be held constant and higher than the melting point of solder. The temperature of a fixed plate 41 is monitored. When the temperature of the plate is higher than or equal to the melting point of the solder and the solter is melted or there is no need to apply heat energy to confirm that the solder is melted, the contact of the thermode with the plate 41 is released. Then the plate 41 and the solder begin to cool. When the temperature sensor indicates the temperature sufficiently low so that a bond is formed, the contact of the plate 41 with the leads 5 is released.</p> |
