| 摘要 |
An envelope (1, 21) produced from a material with low thermal conductivity surrounds a core (2, 22) in which the electronic means (3, 11, 14) are housed.
<??>The material of the core (2, 22) has a specific heat in the solid state such that, when the device is placed in an environment with a high external temperature, the core (2, 22) absorbs an adequate fraction of the heat passing through the envelope (1, 21) to limit the rise in temperature by the electronic means (3, 11, 14) and thus to keep them at a temperature compatible with their operating conditions.
<IMAGE>
|
