发明名称 HERMETICALLY SEALED DIE PACKAGE PROVIDED WITH FLOATING SOURCE
摘要 PURPOSE: To hermetically seal the space of leads and oblong holes with solder be sealing a lid having at least one aperture, on the upper part of sidewall, and sealing the aperture with an insulator having oblong holes through which various leads penetrate. CONSTITUTION: A source lead 52 and a drain lead 12 penetrate the aperture of a lid 54 and penetrate oblong holes 52' and 12' of an insulator, respectively. A sense lead 28, a gate lead 22 and a Kelvin lead 53 penetrate an aperture 60, and penetrate oblong holes 28', 22', 53' of an insulator 64, respectively. End portions of the source lead 52 and the drain lead 12 reach the upper parts of hexagonal apertures 66', 68'. Screws 66, 58 penetrate hexagonal nuts and are accommodated in hexagonal recessed parts 66', 68' in order to easily manufacture a fixed external electric connection part. The insulators 62, 64 are sealed to the lid 54.
申请公布号 JPH04233254(A) 申请公布日期 1992.08.21
申请号 JP19910182048 申请日期 1991.06.26
申请人 HARISU SEMIKONDAKUTAA PATENTSU INC 发明人 ROBAATO JIYOSEFU SATORIAANO
分类号 H01L23/04;H01L23/32;H01L25/07;H01L25/18 主分类号 H01L23/04
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