FLUID COOLING TYPE CIRCUIT PACKAGE ASSEMBLED STRUCTURE

摘要

PURPOSE: To provide a superior fluid cooled circuit package assembly structure capable of efficient cooling without causing a stagnation region of fluid between components, and contributing to reduce the cost. CONSTITUTION: A first circuit board 20 has a front surface mounting at least a heating device 22 thereon. Another surface 21 is disposed, facing the front surface of the first circuit board with a space therefrom. Between both surfaces a channel is formed to flow a coolant fluid over the heating device in a direction parallel to these surfaces. The other surface 21 has through-holes 26-29 for introducing a fluid over the other surface into the channel owing to the flow of the fluid in the channel.