| 摘要 |
PURPOSE: To provide a multilayer printed circuit and manufacturing method thereof. CONSTITUTION: Conductive circuit components of an inner layer of circuit components are made of electroless Cu. An electroless layer faces a sandwiched prepreg resin layer. An Sn coating is applied to the surface of the electroless layer to thereby accelerate the deposition of the electroless Cu to the prepreg resin layer. This invention is esp. suited for manufacturing multilayer circuits having buried through-holes. |
