| 摘要 |
<p>The invention relates to a polymeric base material which is catalytic for metal deposition. The base material comprises a first catalyst comprising a particulate silicate filler dispersed in the polymeric base material and an aromatic moiety having a hydroxyl substituent dissolved in or attached to the polymers of the polymeric base material. The polymeric base material optionally includes a second catalyst for metal deposition selected from the group of noble metals and noble metal compounds. In one aspect, the base material is a laminate comprised of glass cloth prepregs. The impregnating varnish comprises an epoxy resin, a silicate filler, and a curing agent for the epoxy resin, the curing agent being selected from the group consisting of phenolic resins and aromatic compounds having at least one hydroxyl group on the aromatic ring and mixtures of such curing agents. In yet another aspect, the invention comprises printed wiring boards having plated-through holes produced on the above base materials. The walls of the plated-through holes are plated with a copper deposit in which the sum of the thermal expansion and the strain at the elastic limit is approximately the same as the thermal expansion of the thickness of the base material.</p> |
