| 摘要 |
PURPOSE:To reduce the production cost of an electronic component by a method wherein a first lead terminal for the electronic component is formed in one piece at a lead frame and a second lead terminal is arranged and installed in a place which is nearly in line with the first lead terminal. CONSTITUTION:A pair of right and left side frames 11, 12 at a lead frame 10 are connected in one piece by using section bars 13. First lead terminals 2 for electronic components are so formed as to be faced inward between the section bars 13 at the side frame 11. Second lead terminals 3 are arranged and installed so as to be nearly in line with the first lead terminals 2; they are connected to the section bars 13 via narrow-width pieces 14. Semiconductor chips 1 are mounted at tip parts of the first lead terminals 2; they are die- bonded. After that, while the narrow-width pieces 14 are being twisted, the second lead terminals 3 are turned over toward the first lead terminals 2 and reversed, they are put on the semiconductor chips 1. Tip parts of the individual lead terminals 2, 3 are molded; after that, they are stamped by using a punch or the like. |
