Resin sealing of electronic parts

摘要

In the transfer molding of resin to seal an electronic part, a sealed space (38) is formed between molding faces of an upper mold (1) and a lower mold (2). This space includes the resin pot (9), the resin path and the moulding cavities and is evacuated by a vacuum source (40). During molding air and moisture are removed from the molten resin to prevent the formation of voids in the molded article.