| 摘要 |
<p>PURPOSE: To eliminate the possibility that the unity of the seal of ceramic of a substrate is lost, due to differences in coefficients of thermal expansion between cement and plastic of a housing, when an electronic device is exposed to a high temperature. CONSTITUTION: An electronic device 10 includes conductors 46 added onto the substrate on at least two opposite sides on an upper surface 12 and a side wall 13 surrounding the top surface 24 of a substrate 14, and the substrate 14 and the respective conductors 46 are each equipped with a 1st end part 48 embedded near the upper surface 12 of a housing 11 and a 2nd end part 50 added to a bottom surface 35 of the substrate 14. Thus a means which electrically and mechanically couples the substrate 14 with a circuit board is provided.</p> |
