| 摘要 |
PURPOSE:To obtain a hybrid integrated circuit board provided with an insulating layer having a high thermal conductivity, high breakdown voltage, and excellent high-frequency characteristic. CONSTITUTION:A heat resistant insulating resin 24 is formed into a shape corresponding to the resin injecting space or forming space of a top mold 12 by injecting the resin 24 into the space through the resin injecting hole 14 of the mold 12 after an insulating metallic board 20 is placed in the cavity of a bottom mold 10. After copper foil 30 is stuck to the surface of the resin 24 with a bonding agent 28 by using a hot press, outer lead pads 32, die bonding pads 34, conducting paths 36, etc., are formed to prescribed shapes by etching the copper foil 30. |
