| 摘要 |
Photochemical and electroless metallization techniques have been combined to create high resolution circuits with line widths and spaces of about one mil on alumina substrates. In this process, small amounts of a xylene-soluble platinum metallo-organic compound are first applied to the surface of the alumina substrate. A mask is then used to selectively expose the platinum metallo-organic compound to ultraviolet light in the areas that are to be metallized, so as to transform the platinum metallo-organic compound into a xylene-insoluble form. After a xylene rinse removes the original soluble platinum compound from the unexposed areas, the substrate is fired in air at about 450 DEG C. for about five minutes, so as to pyrolize the insoluble, irradiated platinum metallo-organic compound into catalytically active platinum. This is followed by electroless deposition of copper onto the ultraviolet-treated regions where the catalytically active platinum resides.
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