| 摘要 |
The present invention provides a semiconductor laser device which comprises a stem, a cap mounted to the stem, and a semiconductor laser chip carried by the stem within the cap. The laser chip is covered by a protective body which is made of a transparent synthetic resin, preferably a relatively soft resin such as silicone resin. The protective body prevents the laser chip from being adversely affected by moisture and/or dust even if external air gets into the cap. The protective body may be further covered by a second protective body which is made of a relatively hard resin such as epoxy resin.
|
