LITHOGRAPHY PROCESS

摘要

The lithography process method for improving the accuracy of super imposition comprises: applying first pattern materials (11) on a silicon substrate (10) to form a first patern on a chip (1); forming aligning marks on a cutting area (2) between the chips; applying second pattern materials (14) on the first pattern and aligning marks to apply a photoresist layer (15) on the second pattern materials (14) to expose the photoresist (15) selectively to remove the exposed portion of the photoresist; and irradiating a light onto the substrate to detect the coordinates of the aligning marks; thereby removing the error due to the applied condition of the photoresist and the refractive index.